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[Pre-order] HiBy The New R6

[Pre-order] HiBy The New R6

HK$5,498.00
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Description
"HiBy The New R6,由內到外全面升級,DAC與線路的大升級,機身外觀重新設計,擁有極速流暢的操作體驗,同時是市場上罕有支援MQA 16x Unfold的DAP。The New R6 勢必於串流音樂的大勢中擔當重要角色。"

好耐都未試過有一部要預訂仲要限量預訂嘅DAP,冇辦法,外型同功能真係大大躍進, 16倍MQA,預載play store,方便到不得了,喺嚴重缺貨嘅情況下,Szetoproject 每個顏色只係有三部咋,預訂仲送皮套同耳機盒,快L啲撳啦!
(預計11月27號發貨)

詳細規格:
型號:The New R6
系統:DTA無損輸出 Android 9.0
處理器:Qualcomm Snapdragon 660
解碼晶片:ES9038Q2M x 2
Op-Amp及耳擴:OPA1612 x 4(Op-Amp)、SSM6322 x 2(耳擴)
內存:4G RAM + 64G ROM
可擴充容量:支援 1 TB MicroSD卡
顯示屏:5”IPS 1080p
取樣率:DSD512、PCM 32bit/768kHz(最高)
連接:藍牙5.0(UAT、 aptX、aptX HD、LDAC、AAC、SBC)、Wi-Fi、DLNA、USB 3.1 Type-C、Line-out/同軸
輸出功率:4.4mm BAL (750mW@32Ω)、3.5mm BAL(245mW@32Ω)
支援格式:DSD(.dsf / .dff / .iso)、DST壓縮格式、DXD、APE、AIFF、FLAC、WAV、WMA、MP3、AAC、Opus、WMA、Ogg Vorbis等
電池:4500mAh(充滿3小時)
續航時間:單端10小時、平衡8.5小時
Quick Charge:QC3.0
體積:130*73*15mm
重量:235g
配件: Type C to RCA同軸線、USB Type-C線、貼膜2張 建議零售價:$5,498(鋁合金銀、鋁合金黑)


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